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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Devices and methods for deposition" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,913, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Devices and methods for deposit... Read More


US Patent Issued to Tokyo Electron on July 21 for "Method and device for forming tungsten film, and device for forming intermediate film before forming tungsten film" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,914, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Method and device for forming tungsten film, and device for forming i... Read More


US Patent Issued to Tokyo Electron on July 21 for "Substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,915, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method" was invented by Atsuki Fukazawa (Tokyo) ... Read More


US Patent Issued to ASM IP Holding on July 21 for "Method, system and apparatus for forming a metal sulfide layer" (Belgian, Finnish Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,916, issued on July 21, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method, system and apparatus for forming a metal sulfid... Read More


US Patent Issued to ASM IP Holding on July 21 for "Methods for depositing a film on a surface of a substrate by cyclical deposition methods including pulsed purge processes" (Arizona Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,917, issued on July 21, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Methods for depositing a film on a surface of a substra... Read More


US Patent Issued to Applied Materials on July 21 for "Cleaning operations based on deposition thickness" (California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,918, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Cleaning operations based on deposition thickness" w... Read More


US Patent Issued to United Semiconductor (Xiamen) on July 21 for "Deposition machine exhaust gas pipeline and operation method thereof" (Chinese, Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,919, issued on July 21, was assigned to United Semiconductor (Xiamen) Co. Ltd. (Xiamen, China). "Deposition machine exhaust gas pipeline an... Read More


US Patent Issued to KALPANA TECHNOLOGIES on July 21 for "Roll-to-roll processing" (Dutch Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,920, issued on July 21, was assigned to KALPANA TECHNOLOGIES B.V. (Rotterdam, Netherlands). "Roll-to-roll processing" was invented by Diede... Read More


US Patent Issued to American Air Liquide on July 21 for "Fluorination of ancillary ligands of group (III) precursors and their applications in vapor depositions" (Delaware Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,921, issued on July 21, was assigned to American Air Liquide Inc. (Newark, Del.). "Fluorination of ancillary ligands of group (III) precurs... Read More


US Patent Issued to WONIK IPS on July 21 for "Substrate processing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,922, issued on July 21, was assigned to WONIK IPS Co. LTD. (Pyeongtaek-si, South Korea). "Substrate processing apparatus" was invented by T... Read More